JPS647496B2 - - Google Patents
Info
- Publication number
- JPS647496B2 JPS647496B2 JP277688A JP277688A JPS647496B2 JP S647496 B2 JPS647496 B2 JP S647496B2 JP 277688 A JP277688 A JP 277688A JP 277688 A JP277688 A JP 277688A JP S647496 B2 JPS647496 B2 JP S647496B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- resin material
- exterior resin
- molding
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 65
- 229920005989 resin Polymers 0.000 claims description 65
- 239000000463 material Substances 0.000 claims description 50
- 238000000465 moulding Methods 0.000 claims description 27
- 239000004065 semiconductor Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 8
- 230000017525 heat dissipation Effects 0.000 description 9
- 230000003014 reinforcing effect Effects 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 239000004519 grease Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP277688A JPS63211638A (ja) | 1988-01-08 | 1988-01-08 | 樹脂封止型半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP277688A JPS63211638A (ja) | 1988-01-08 | 1988-01-08 | 樹脂封止型半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63211638A JPS63211638A (ja) | 1988-09-02 |
| JPS647496B2 true JPS647496B2 (en]) | 1989-02-09 |
Family
ID=11538743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP277688A Granted JPS63211638A (ja) | 1988-01-08 | 1988-01-08 | 樹脂封止型半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63211638A (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290132A (ja) * | 2000-12-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | 小型アンテナ及びその製造方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6743801B2 (ja) * | 2017-10-27 | 2020-08-19 | 日亜化学工業株式会社 | 発光装置の製造方法 |
Family Cites Families (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS499913A (en]) * | 1972-05-13 | 1974-01-29 | ||
| JPS49116967A (en]) * | 1973-03-09 | 1974-11-08 | ||
| JPS5149192B2 (en]) * | 1973-06-20 | 1976-12-24 | ||
| JPS538635B2 (en]) * | 1973-07-20 | 1978-03-30 | ||
| JPS513578A (ja) * | 1974-06-27 | 1976-01-13 | Nippon Electric Co | Jushimoorudogatahandotaisochi |
| JPS5952539B2 (ja) * | 1977-02-07 | 1984-12-20 | 株式会社東芝 | 半導体装置のトランスフアモ−ルド装置 |
| JPS5527248Y2 (en]) * | 1977-09-14 | 1980-06-30 | ||
| JPS5558053U (en]) * | 1978-10-11 | 1980-04-19 | ||
| JPS5713802Y2 (en]) * | 1978-10-25 | 1982-03-19 | ||
| JPS595981Y2 (ja) * | 1978-12-25 | 1984-02-23 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置 |
| JPS607484Y2 (ja) * | 1979-01-18 | 1985-03-13 | 日本電気ホームエレクトロニクス株式会社 | 電子部品の樹脂モ−ルド装置 |
| JPS5915391B2 (ja) * | 1979-05-25 | 1984-04-09 | シャープ株式会社 | 光結合素子 |
| JPS6016747B2 (ja) * | 1979-06-23 | 1985-04-27 | 日本電気ホームエレクトロニクス株式会社 | 半導体装置の製造方法 |
| JPS5613738A (en) * | 1979-07-13 | 1981-02-10 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS5687330A (en) * | 1979-12-18 | 1981-07-15 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS5927066Y2 (ja) * | 1979-12-24 | 1984-08-06 | 日本電気ホームエレクトロニクス株式会社 | 樹脂封止半導体装置 |
| JPS6120758Y2 (en]) * | 1980-05-29 | 1986-06-21 | ||
| JPS5710745U (en]) * | 1980-06-20 | 1982-01-20 | ||
| JPS5773932U (en]) * | 1980-10-23 | 1982-05-07 | ||
| JPS5793516A (en) * | 1980-12-03 | 1982-06-10 | Fujitsu Ltd | Method of sheathing electronic part |
| JPS57132462U (en]) * | 1981-02-10 | 1982-08-18 | ||
| JPS59111334A (ja) * | 1982-12-17 | 1984-06-27 | Toshiba Corp | モ−ルド金型 |
-
1988
- 1988-01-08 JP JP277688A patent/JPS63211638A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002290132A (ja) * | 2000-12-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | 小型アンテナ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63211638A (ja) | 1988-09-02 |
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